Catalog 2016-2017 
    
    Oct 19, 2018  
Catalog 2016-2017 [ARCHIVED CATALOG]

ELEC 126 Electronics Manufacturing Testing Techniques II

5 credits
Introduction to surface mount techniques and advanced methods of fabrication that are utilized throughout the electronics industry. Basic manual electronic manufacturing techniques, safety procedures and shop practices and techniques are explored, as well as proper hand tool selection, care and utilization.

Prerequisites: ELEC 115 .

Quarters Offered: Fall, Summer

Student Outcomes/Competencies:
Upon successful completion of this course students will be able to:

  • Interpret and apply safety codes, policies, and practices, and accident prevention procedures
  • Apply recommended procedures for the safe handling, storage and disposal of hazardous materials using MSDS data to identify or label hazardous materials
  • Conduct safety inspections of shop environments, detect hazardous conditions and take corrective actions
  • Use protective equipment and clothing to ensure personal health and safety in the workplace
  • Select, operate, and maintain hand and power tools safely
  • Apply basic soldering techniques for surface mount and socket mounted components
  • Apply ESD procedures when handling surface mount electronic components
  • Prepare common wire and cable assemblies for surface mount combination assemblies
  • Repair sub-assemblies and replace electronic components on surface mount printed circuit board assemblies (PCBAs)
  • Apply regulatory and licensing requirements when completing installations, maintenance and repairs of surface mount applications
  • Analyze hand, wave and reflow soldering processes for surface mount technology applications
  • Maintain surface mount soldering-station components such as solder tips, solder extraction tips and solder collection chamber
  • Select the correct tools required to perform solder extraction on surface mount assemblies
  • Remove surface mount components using the following methods:  wicking, vacuum, pulse, combination iron-sucker, heat and pull
  • Install surface mount electronic components on single-sided and double-sided printed circuit boards following QA/QC procedures