Catalog 2016-2017 
    
    Jul 16, 2018  
Catalog 2016-2017 [ARCHIVED CATALOG]

ELEC 115 Electronics Manufacturing Testing Techniques I

5 credits
Introduction to techniques and methods of fabrication that are utilized throughout the electronics industry. Basic manual electronic manufacturing techniques, safety procedures, and shop practices and techniques are explored, as well as proper hand tool selection, care and utilization.

Prerequisites: MATH 087 , ENGL 093 , or equivalent placement scores, or instructor permission.

Quarters Offered: Fall, Spring, Summer

Student Outcomes/Competencies:
Upon successful completion of this course students will be able to:

  • Interpret and apply safety codes, policies, and practices, and accident prevention procedures
  • Apply recommended procedures for the safe handling, storage and disposal of hazardous materials using MSDS data to identify or label hazardous materials
  • Conduct safety inspections of shop environments, detect hazardous conditions and take corrective action
  • Use protective equipment and clothing to ensure personal health and safety in the workplace
  • Select, operate, and maintain hand, power tools and solder equipment safely
  • Apply basic soldering techniques including excess solder removal
  • Prepare common wire and cable assemblies
  • Repair sub-assemblies and replace electronic components on through-hole printed circuit board assemblies (PCBAs)
  • Apply regulatory and licensing requirements when completing installations, maintenance and repairs of electronic equipment
  • Analyze the soldering processes and the different types and applications of solder and solder flux
  • Select the correct soldering tip and temperature for the specific soldering and solder extraction application
  • Remove components using the following methods:  wicking, vacuum pulse; combination iron-sucker; heat and pull
  • Extract solder from:  through-hole mounted components; large thermal mass joints; terminals and socket mounted components
  • Install electronic components on single-sided and double-sided printed circuit boards following QA/QC procedures
  • Apply component handling precautions such as ESD precautionary techniques